摘要
为了实现大尺寸液玻璃基板的精确切割断裂,本文提出了液晶玻璃基板切割和裂片关键技术新的解决方法。通过采用上压轮和下刀轮的上下差补定位运行,达到了沿着同一切割路径在液晶面板上的精确切割,通过上压轮接触切割线的方法,达到了裂片的目的,并使用气缸和吸盘吸附废边,将废边去处。分析了大尺寸液晶玻璃基板的切割和裂片工艺,并通过研究刀轮角度选择和切割压力、刀轮入刀量、切割速度和裂片压力等工艺参数的设置,实现了设备的平稳运行。
In order to achieve accurate cutting and splitting of large size liquid glass substrates, a new technology solution was proposed. By using the upper and lower differential positioning of the upper pressure wheel and the lower cutter wheel, the accurate cutting along the same cutting path on the liquid crystal panel was achieved. Through the method that the upper pressure wheel contacts cutting line, the purpose of splitting was achieved, and the waste edges were absorbed by the cylinder and the suction disc. The cutting and splitting process of large size liquid crystal glass substrate are analyzed. The process parameters such as cutter wheel angle selection, cutting pressure, cutting speed of cutter wheel, cutting speed and splitting pressure are set up, and the smooth operation of the equipment is realized..
作者
曹力宁
蔡克新
CAO Lining;CAI Kexin(The Second Research Institute of CETC,Taiyuan 030024,China)
出处
《电子工艺技术》
2018年第4期231-234,共4页
Electronics Process Technology
关键词
大尺寸液晶玻璃
切割
裂片
工艺参数
large size liquid crystal glass
cutting
splitting
process parameters
