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Athermal 4-channel (de-)multiplexer in silicon nitride fabricated at low temperature 被引量:4

Athermal 4-channel (de-)multiplexer in silicon nitride fabricated at low temperature
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摘要 We have designed and realized an athermal 4-channel wavelength(de-)multiplexer in silicon nitride(Si N).Minimized thermal sensitivity is achieved in a wide wavelength range by using wide and narrow waveguides with low and different thermal-optic coefficients in the two arms of Mach–Zehnder interferometers(MZIs). The Si N core layer and Si O2 cladding layers are deposited by a low-temperature plasma-enhanced chemical vapor deposition process. The fabricated MZI filter exhibits a thermal sensitivity within 2.0 pm∕°C in a wavelength range of 55 nm to near 1300 nm. Then, an athermal(de-)multiplexer based on cascaded MZIs has been demonstrated with a crosstalk ≤-22 d B and a thermal sensitivity <4.8 pm∕°C for all four channels, reduced by 77% compared to a conventional Si N(de-)multiplexer. Owing to the passive operation and compatibility with the CMOS backend process, our devices have potential applications in 3 D integration of photonics and electronics. We have designed and realized an athermal 4-channel wavelength(de-)multiplexer in silicon nitride(Si N).Minimized thermal sensitivity is achieved in a wide wavelength range by using wide and narrow waveguides with low and different thermal-optic coefficients in the two arms of Mach–Zehnder interferometers(MZIs). The Si N core layer and Si O2 cladding layers are deposited by a low-temperature plasma-enhanced chemical vapor deposition process. The fabricated MZI filter exhibits a thermal sensitivity within 2.0 pm∕°C in a wavelength range of 55 nm to near 1300 nm. Then, an athermal(de-)multiplexer based on cascaded MZIs has been demonstrated with a crosstalk ≤-22 d B and a thermal sensitivity <4.8 pm∕°C for all four channels, reduced by 77% compared to a conventional Si N(de-)multiplexer. Owing to the passive operation and compatibility with the CMOS backend process, our devices have potential applications in 3 D integration of photonics and electronics.
出处 《Photonics Research》 SCIE EI 2018年第7期686-691,共6页 光子学研究(英文版)
基金 863 Program(2015AA016904) National Natural Science Foundation of China(NSFC)(61335002,11574102,61675084,61775094)
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