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模压工艺对聚酰亚胺树脂力学性能的影响 被引量:1

Effects of Molding Process on Mechanical Properties of Polyimide Resin
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摘要 以均苯四甲酸二酐、4,4'-双(氨基苯氧基)二苯砜为主要单体,制备了模压级聚酰亚胺(PI)树脂,并对该树脂的模压成型工艺进行了研究。考察了模压温度、模压压力和模压时间对PI制件拉伸强度、弯曲强度和压缩强度的影响。结果表明:该PI树脂的最佳模压工艺条件为模压温度350℃、模压压力18 MPa、模压时间120min。在该条件下,所制PI制件的拉伸强度、弯曲强度和压缩强度分别为108.6、145.8、139.8 MPa。 A molding type polyimide(PI) was copolymerized with pyromellitic dianhydride and bis[4-(4-aminophenoxy)phenyl] sulfone which served as main monomers, and its molding process was studied. The effects of molding temperature, molding pressure and molding time on mechanical properties, such as tensile strength, flexural strength and compressive strength, of the PI product were investigated. The results show that the appropriate molding conditions are: molding temperature 350℃, molding pressure 18 MPa, molding time 120 min. On this condition, the PI product shows better mechanical properties, the tensile strength, flexural strength and compressive strength are 108.6, 145.8 and 139.8 MPa, respectively.
作者 王洋 熊平 周利庄 刘永亮 黄活阳 Wang Yang;Xiong Ping;Zhou Lizhuang;Liu Yongliang;Huang Huoyang.(Changsha Advanced Material Industry Research Institute Co., Ltd.Changsha 410205,China)
出处 《塑料科技》 CAS 北大核心 2018年第7期73-75,共3页 Plastics Science and Technology
基金 湖南省科学技术厅航天新材料重点实验室项目(2017TP1032)
关键词 模压级聚酰亚胺树脂 模压工艺 力学性能 Molding-type PI Molding process Mechanical properties
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