摘要
本文重点介绍了亚硫酸盐镀金、硫代硫酸盐镀金、亚硫酸盐-硫代硫酸盐复合配合剂镀金、乙内酰脲镀金等无氰电镀金工艺。综述了每种镀液体系的基本组成、配位剂与金离子的配位形式、镀金工艺参数及限制其发展的各种因素。对相关镀液体系中金的电沉积行为进行了总结,并对未来无氰电镀金工艺的发展方向进行了展望。
In this paper,several kinds of non-cyanide gold plating technologies using sulphite,thiosul-fate,sulphite-thiosulfate and hydantoin as complexing agents were comprehensively studied. Electrolytecomposition,coordination form of complexing agent and gold ion,gold plating process parameters andvarious factors that limit the development of each bath system were summarized. The electrodepositionbehavior of gold in related bath was also discussed and the development trend of non-cyanide gold plat-ing technology was prospected.
作者
杨潇薇
YANG Xiaowei(Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621900, China)
出处
《电镀与精饰》
CAS
北大核心
2018年第5期19-25,共7页
Plating & Finishing
关键词
电镀金
无氰
镀液体系
gold plating
non-cyanide
plating electrolyte system
