摘要
随着电子信息设备工作频率的日益提高,高速PCB线路将产生越来越严重的串扰和辐射,继而影响产品性能且使得设备电磁兼容性不达标。该文以一款计算机主板为例,使用ANSYS公司的SIwave仿真软件,从PCB谐振、线间串扰及电磁辐射三个方面对此PCB主板进行仿真研究,并针对问题做出改进优化,从而改善了该高速PCB的电磁兼容性。
With the increasing frequency of electronic information equipment,high-speed PCB circuit will produce more and more serious crosstalk and radiation,and then affect the product performance,and make the equipment electromagnetic compatibility is not up to standard.This paper use ANSYS＇s Slwaveto simulate and analysis the motherboard PCB from PCB resonance,crosstalk and electromagnetic radiation three aspect by an example of a computer motherboard.Finally,improve and optimize motherboard PCB to improve the equipment＇s electromagnetic compatibility.
出处
《电子质量》
2018年第2期74-79,共6页
Electronics Quality
