摘要
通过电信号测试、外观形貌观察、IV特性测试、X-ray观察、C-SAM分析、开封、切片等方法,对由打磨翻新的LB1836型器件导致仪器内置打印机无法正常工作的故障进行失效分析。失效案例展示了LB1836型器件内部芯片本体开裂引起管脚间开路,最终导致仪器内置打印机无法正常工作的具体表现,并展示了IC分析的一般步骤和方法。分析表明,所用LB1836型器件为翻新品,翻新过程中,打磨器件表面的机械应力造成内部芯片开裂,从而导致器件管脚间开路,最终致使仪器故障。
Using the methods of electric signal test on board, morphology observation, IV characteristic test, X-ray, C-SAM, Decap and crossection, to analyse the luminous instrument fault caused by refurbished device. The case shows the phenomenon of device pins open caused by internal chip crackin, and eventually leads to the failure of the printer in the luminous instrument. Analysis methods of the failed IC are also showed in this paper. Analysis result indicates that the LB1836 devices are refurbished, mechanical stress in the polishing process caused damage to the device, even caused internal chip cracking, and then resulted in the device pins open, and eventually lead to the luminous instrument fault.
出处
《中国医疗器械信息》
2018年第3期18-21,共4页
China Medical Device Information
关键词
失效分析
翻新器件
打磨
机械应力
外观形貌
芯片开裂
failure analysis, counterfeit and refurbished device, polish, mechanical stress, exterior morphology, chip crack
