摘要
与传统的分析方法相比较,文中设计优化了失效分析方案。采用先进的Lightemission、SAM等技术,提高了集成电路失效分析的成功率和准确度。对IC的设计、研究和生产有积极的指导作用。
Improved failure analysis project is put forward. Light emission and SAM are introduced that advanced the veracity and successful rate of FA. It gives active instruction to IC designing, study and manufacture.
出处
《电子测量技术》
2006年第4期168-169,共2页
Electronic Measurement Technology
关键词
失效分析
无损探伤
热点捕捉
failure analyses
lossless defect detecting
hot spot capture
