摘要
基于大功率半导体激光器（LD）高输出功率、高热流密度的特性,按照散热能力大小的分类,系统的介绍了传导冷却热沉、高速液冷冷却热沉、相变制冷微蒸发腔热沉的原理、结构、制作工艺;以及三类热沉相应的封装技术与目前发展现状。
Based on the features of high output power and high thermal flux of high power semiconductor laser,a detailed introduction of principles,structures as well as the craftsmanship of three types of heat sinks which are conductive cooling heat sink,high-speed liquid cooling heat sink as well as micro-evaporation cavity heat sink based on phase change cooling. The classification is based on the differences of heat dissipation and a large number of domestic and abroad documents. Packaging technology and development status of each heat sink are also demonstrated in this article.
出处
《激光杂志》
北大核心
2018年第2期14-19,共6页
Laser Journal
基金
国家自然科技基金青年基金(No.61008059)
重庆市教委应用基础研究项目(No.KJ1600311)
重庆市科委前沿基础研究项目(No.cstc2014jcyjA70005)项目资助
关键词
微蒸发腔
高功率半导体激光器
热沉
micro-evaporation cavity
high power semiconductor laser
heat sink
