摘要
针对现有商用SiC功率模块寄生电感大这一问题,提出一种基于直接覆铜陶瓷基板(DBC)+柔性印刷电路板(FPC)的新型混合封装结构,并设计了一种基于该结构的高速低感SiC半桥功率模块。利用DBC+FPC的多层结构,通过优化布局,形成了互感抵消回路,同时利用FPC薄的特点来增强互感抵消作用,使得主回路的寄生电感降至2.5 nH左右。设计并加工了一个1200 V,40 A的全SiC半桥功率模块,通过阻抗测试和双脉冲测试,验证了模块的低寄生电感特点及高速开关的性能。
Aiming at the problem of the large parasitic inductance of the existing commercial SiC module,a novel hybrid structure with direct bonding copper （DBC）＋flexible printed circuit board （FPC） is presented, and a high-speed and low-inductance SiC half-bridge module is designed based on this structure.Through the optimization of the layout and forming the mutual inductance canceling circuit to exist in the commutation process, and the mutual inductance can- celing effect is enhanced by the thin FPC, so that the parasitic inductance of the communication loop is reduced to about 2.5 nil.The design and processing of 1 200 V, 40 A full SiC half-bridge power module are presented.The low parasitic inductance and the performance of the high-speed switching are verified by impedance test and double pulse test.
出处
《电力电子技术》
CSCD
北大核心
2017年第12期20-22,共3页
Power Electronics
基金
国家自然科学基金(51507069)
台达电力电子科教发展计划青年基金(DREG2015009)~~
关键词
混合封装结构
半桥模块
低寄生电感
hybrid packaging structure
half-bridge module
low parasitic inductance
