摘要
钻孔是整个PCB生产流程中一个相当重要的环节,如果在钻孔后次表层或内层铜箔产生毛刺,将会对后续工序产生不良影响。有必要对毛刺的产生机理及控制进行深入研究。本文分析了金属化孔内毛刺产生的机理,并结合试验研究,提供了控制孔内毛刺的有效措施。
Drilling is a very important part in the entire PCB production process, and burrs in the subsurface or inner foil will have adverse effects on subsequent steps. It is necessary to study burr generation mechanism and control it. This study reveals the mechanism of plated through hole, and provides effective measures to control the burr hole based on experiment.
出处
《印制电路信息》
2017年第9期51-59,共9页
Printed Circuit Information
关键词
金属化孔
毛刺
改善措施
Plated Through Hole
Burr
Improvement Measures
