摘要
由于柯肯德尔效应,异质金属键合不可避免地会在键合界面扩散形成金属间化合物,进而形成可见的柯肯德尔空洞,导致焊点脱开失效。以Si-Al丝超声键合技术研究为出发点,针对线径25μm的Si-Al丝,通过正交试验设计、拉力测试及显微镜目测相结合的方法,在硅基Al焊盘上研究了超声功率、压力与时间对Si-Al丝超声键合强度的影响,总结了Si-Al丝超声键合工艺窗口。经实践证明,按照该种工艺键合的产品可符合产品要求。
Intermetallic Compound（IMC） is unavoidable during bonding process with two kinds of materials because of Kirkendall effect.It causes Kirkendall voids ultimately and leads bonding failure.Introduce bonding techniques of Si-AI wire on Si die with Al pad,the diameter of Si-AI wire is 25 pm.The effect of ultrasonic power,bonding pressure and bonding time on bonding intension of Si-AI wire ultrasonic bonding were studied based on orthopedic experiment design,pulling test and micrography.The Si-AI wire ultrasonic bonding parameters were founded.The practice shows that the product made by the technology can meet the requirement.
出处
《电子工艺技术》
2017年第4期203-207,共5页
Electronics Process Technology
基金
国家重大专项基金项目(项目编号:2013ZX01034001-004)
关键词
Si-Al丝
超声键合
键合强度
正交实验
Si-Al wire
ultrasonic bonding
bonding intension
orthogonal experiment
