摘要
在PCB防焊制程后部分产品要求进行化金表面处理,有的表面会出现不规则块状灰白色印迹,称作为"水印"不良。探讨"水印"原因,认为由于防焊油墨本身的制作会受到光聚合条件和热聚合条件的影响,及PCB在化金制作过程中会受到物理热传递和热胀冷缩效应影响。
In the PCB soldermask process, some products require the gold surface treatment process. Due to the production of soldermasks itself by light effect of polymerization and thermal polymerization conditions, PCB will have the contraction effect of heat transfer and thermal effect of physical gold in the production process. The ink layer the surface appears irregular grey imprinting, in the industry known as the ＂watermark＂ bad
出处
《印制电路信息》
2017年第6期25-28,59,共5页
Printed Circuit Information
关键词
液态感光油墨
光聚合反应
热聚合反应
化金
水印
Liquid Photosensitive Ink
Light Polymerization Reactive
Thermal PolymerizationReactive
Immersion Gold
Watermark
