摘要
为了确认抛光过程中抛光盘大小对光学元件表面中频误差的影响,对双轴式平面研磨抛光的去除特性进行了分析。推导了去除函数的表达式,计算了抛光盘大小对元件的去除量以及其分布的影响。结果表明,不论抛光盘大小如何改变,回转中心的去除量总是最大,去除量最大区域所对应半径随着抛光盘半径的增大而增大,利用这一关系确定了导致中频误差产生的磨头尺寸。通过选择合适的抛光盘尺寸,可以对最大去除量区域范围进行控制,从而有效减少工件在研磨抛光过程中中频误差的产生。
To confirm the influence of the grinding head＇size on the surface error with mid-spatial-frequency of the optical element,the removal characteristics of two-axis plane polishing is analyzed.The removal function is derived and the influence on the removal amount and its distribution of the pads size are calculated.The results show that no matter what size polishing pad is chosen the removal amount of center of rotation always be the largest.Moreover,the radius of the area with high removal amount will increases with the increase of pads radius.According to this result the relationship between the size of polishing pad and mid-spatial-frequency surface error is established.By selecting the appropriate size of pad the generation of mid-spatial-frequency error should be controlled.
出处
《光学与光电技术》
2017年第1期54-58,共5页
Optics & Optoelectronic Technology
基金
四川省教育厅创新团队(13TD0048)资助项目
关键词
平面研磨
去除量
去除函数
中频误差
plane polishing
removal quantity
removal function
mid-spatial-frequency error
