摘要
当电子计算机辅助设计(ECAD)遇上机械计算机辅助设计(MCAD)时,设计电子新产品的过程、方法等发生了质的飞跃。三维(3D)设计能准确表达工程师的设计思想,符合工程师的思维方式和设计习惯,是实现新产品质飞跃的最佳方式之一。在设计电子新产品时,可以在ECAD中将电子产品的3D模型效果图设计好,再导入MCAD中,由机械设计师全面、客观地对该电子产品进行机械、结构、外壳等设计。实验结果表明,该方法能提前预知新产品的实际效果,可以有效避免电子产品与机械外壳不匹配的情况,大大提高了设计效率,并改进了设计质量,实现了电子与机械设计的同步进行,加快了设计与制造的一体化进程。
When the electronic computer aided design（ECAD） meets the mechanical computer aided design （MCAD）, the process, method and scheme of the design in the new electronic products will have a qualitative leap, and the three-dimensional（3D） design is one of the best ways to realize the improvement of new production quality. 3D design could accurately express the engineer＇s design ideas, according with engineers＇ thinking mode and design habits. In the design of new products, engineers could import the three-dimensional model of the electronic products to MCAD software, then mechanical designers were expected to observe the appearance comprehensively and objectively, then design its mechanical, structure and shell. Experimental results indicated that the proposed method could predict the actual effect of the new product in advance, avoiding the mismatch between the electronic products and the mechanical casing. Also it had improved greatly the design efficiency and design quality, and had achieved the synchronous design of the electronic and mechanical products. It had actualized the integration of design and manufacture.
出处
《微电子学》
CAS
CSCD
北大核心
2017年第1期96-99,共4页
Microelectronics
基金
重庆市科技攻关资助项目(CSTC
2011AC2078)
