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反应烧结制备Cu/TiC结合剂金刚石复合材料

Fabrication of Cu/TiC Bonded Diamond Composite by Reaction Sintering
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摘要 采用Cu/Ti/C/Diamond粉体为原料,通过原位反应烧结技术,制备Cu/TiC结合剂金刚石复合材料。采用X射线衍射、扫描电镜和洛氏硬度仪分析试样。结果表明,在1000℃保温1h,反应烧结得到Cu/TiC金属陶瓷复合结合剂金刚石材料。当Cu含量较低时,产物中有一定量的CuTi_x相;当Cu含量较高时,产物的主要相为Cu、CuTi、TiC。断口形貌表明,高Cu含量的基体与金刚石有着良好的结合。 Taking Cu/Ti/C/Diamond mixed powders as raw material, Cu/TiC bonded diamond composite was fabricated by in-situ reaction sintering. The sample was analyzed by XRD, SEM and Rockwell hardness tester. The results show that Cu/TiC bonded diamond composite is fabricated by reaction sintering at 1000℃ for lh. When Cu content is lower, a certain amount of CuTix phase also exist in the products. When Cu content in the sample is higher, the main phase of the products is Cu, CuTi and TiC. The fracture morphology of the samples shows that the matrix with high Cu content has a good combinition with the diamond.
出处 《热加工工艺》 CSCD 北大核心 2016年第20期131-132,135,共3页 Hot Working Technology
基金 国家自然学基金资助项目(5043202) 国家973基金资助项目(2007CB607603)
关键词 Cu/TiC 金刚石 反应烧结 Cu/TiC diamond reaction sintering
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