摘要
酸改性环氧树脂可用于印制电路板(PCB)基材上的阻焊油墨.传统的二步法合成酸改性环氧树脂,反应过程不好控制,容易产生凝胶.本文以反丁烯二酸、丙烯酸为改性剂,采用一步合成法,在双酚A环氧树脂上接枝羧基及带双键的光敏基团,制备UV固化酸改性环氧树脂.通过傅里叶转换红外光谱分析(FTIR)、凝胶渗透色谱(GPC)、超声波显微分析(SAM)、色差分析、热老化分析等表征,结果表明:采用一步法合成的酸改性环氧树脂的平均分子量更大分布更加均匀,固化后机械综合性能、耐热老化性能等均好于二步法合成酸改性环氧树脂工艺,并较好解决了二步法工艺容易凝胶的问题.
Fumaric acid and acrylic acid were used as modifying agent. UV sensitive acld-modified epoxy resin was synthesized by introducing earboxyl group and photosensitive group to bisphenol-A epoxy resin by one-step process as it was easy to cause gelation to synthesize acid-modified epoxy resin by traditional two-step method. The modified resin was the main component of solder resist ink used on the surface of printed circuit board（PCB）. Characterization such as Fourier transform infrared spectroscopy（FT-IR）, gel permeation chromatography（GPC）, scanning acoustic microscope（SAM）, chromatism, thermal aging analysis and so on were conducted. The resuh showed that average molecular weight of acid-modified epoxy resin synthesized by one-step process was bigger and polydispersity was more narrow comparing with that of acid-modified epoxy resin synthesized by two-step process. Overall mechanical properties and thermal aging resistance performance of acid-modified epoxy resin synthesized by one-step proeess were better than these of acid-modified epoxy resin synthesized by two-step process. Furthermore, gel problem was solved.
出处
《复旦学报（自然科学版）》
CAS
CSCD
北大核心
2016年第4期482-489,共8页
Journal of Fudan University：Natural Science
基金
国家创新基金(1203H157000
12C26213102007)
宝山区科委2014年项目
关键词
酸改性环氧树脂
UV光敏性
热老化性
阻焊油墨
acid-modified epoxy resin
UV photosensitiveness
thermal aging resistance
solder resist ink
