摘要
文章从工程角度出发,使用仿真软件分别对极高频(Extremely High Frequency,EHF)频段芯片的引线键合和装配公差进行了仿真分析,确定键合线的拱高、距离等参数,明确装配公差的合理范围,以便减小芯片级联时的射频损耗,并满足多个射频模块之间的一致性要求。
This paper conducts simulation analysis on EHF band chip bonding and assembly tolerances by using simulation software from the view of the engineering, then determines the parameter of bonding wire such as arch height and distance, clears the reasonable range of assembly tolerance in order to reduce RF loss in the chip cascade and meet the consistent requirements among multiple radio frequency modules.
出处
《无线互联科技》
2016年第15期80-82,共3页
Wireless Internet Technology
