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基于LTCC基板的X波段四通道T/R组件的设计 被引量:4

The Design of X-band 4-channel T/R Module Based on LTCC Substrate
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摘要 介绍了一种X波段四通道T/R组件的设计思路和实现方法。针对组件工作频率高、工作频段宽、通道数多、功能复杂、裸芯片多、重量要求严格等难点,组件采用低温共烧陶瓷设计、MCM设计、新型硅铝盒体材料设计等先进技术,成功研制出了低噪声、轻质量、功能齐全的小型化四通道T/R组件,该组件工作带宽在X波段达到2 GHz,发射功率达到+41 d Bm,发射效率达到32%,接收噪声系数达到2.5~2.8 d B,移相精度达到20(RMS),整体重量为96 g。组件已实现批量化生产。 This paper introduces the design idea and the implement method of a kind of X-band four-channel T /R module. Such advanced technologies as LTCC,MCM and new silicon aluminum material design are adopted in the module,in view of some difficulties such as higher working frequency,broader bandwidth,complex function,more channels,more bare chips,strict weight demand and so on. The miniaturized four-channel T / R module is developed successfully with low noise figure,light weight,and complete functions. The operation bandwidth can be up to 2GHz,the transmitting power can reach up to 41 d Bm,the transmitting efficiency is as high as 32%,the noise figure is 2. 5 ~ 2. 8 d B,the phase shift precision( RMS value) is 2°,and the whole weigh is only 96 g. The module has been in the stage of mass production.
作者 戈江娜
出处 《电子科技》 2016年第6期92-95,99,共5页 Electronic Science and Technology
关键词 LTCC MCM 硅铝材料 芯片自动粘结 自动键合 LTCC MCM silicon-aluminum material chip automatic attaching automatic bonding
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参考文献15

  • 1胡明春,,周志鹏,,严伟..相控阵雷达收发组件技术[M].北京:北京/国防工业出版社,2010:342页.
  • 2吴礼群,孙再吉.T/R组件核心技术最新发展综述(一)[J].中国电子科学研究院学报,2012,7(1):29-33. 被引量:15
  • 3Richard Decker, Ramanni Tatikola, Narayan Rangappa My- soor. Multichip MMIC package for X and Ka bands [ J]. IEEE Transactions on MTT, 1997,20( 1 ) :27 - 32. 被引量:1
  • 4Mark S Hauhe,John J Wooldridge. High density packaging of X - band array modules [ J ]. IEEE Transactions on CPMT, 1997,20 ( 3 ) : 279 - 291. 被引量:1
  • 5Sturzebecher D, Leen J, Cadotte R, et al. 20GHz LTCC phased array module [ C ]. NY USA: IEEE MTT - S Digest, 1996. 被引量:1
  • 6杨邦朝,张经国主编..多芯片组件 MCM 技术及其应用[M].成都:电子科技大学出版社,2001:653.
  • 7Christoph H Gierull. Statistical analysis of muhilook SAR in- terferograms for CFAR detection of ground moving targets [ J ]. IEEE Transactions on Geoscience and Remote Sensing, 2004,42(4) :691 -701. 被引量:1
  • 8Schmuckle F J, Jentzsch A, Heinrich W, et al. LTCC as MCM substrate: deaign of strip - line structure and flip - chip interconnects [ C ]. Phoenix, USA : IEEE MTT - S Di- gest ,2001. 被引量:1
  • 9Ponchak G E, chen D, Yook J G. Characterrization of plated via hole fences for isolation beteeen stripline circuits in LTCC packages[J]. IEEE MTT- S International Microwave Symposium Digest, 1998 ( 3 ) : 1831 - 1834. 被引量:1
  • 10严伟,洪伟,薛羽.低温共烧陶瓷微波多芯片组件[J].电子学报,2002,30(5):711-714. 被引量:23

二级参考文献7

  • 1[1]D Richard Decker,Ramani Tatikola,Narayan Rangappa Mysoor.Multichip MMIC package for X and Ka bands [J].IEEE Transactions on MTT,February 1997,20(1):27-32. 被引量:1
  • 2[2]Mark S Hauhe,John J Wooldridge.High density packaging of X-band array modules [J].IEEE Transactions on CPMT,August 1997,20(3):279-291. 被引量:1
  • 3[3]D Sturzebecher,J Leen,R Cadotte,etc.20GHz LTCC Phased Array Module [M].IEEE MT T-S Digest,1996:991-994. 被引量:1
  • 4[4]George E Ponchak,Donghoon Chen,Jong-Gwan Yook,Linda P B Katehi.Characterization of Plated Via Hole Fences for Isolation Between Stripline Circuits in LTCC Pack ages [M].IEEE MTT-S Digest,1998.1831-1834. 被引量:1
  • 5[5]A Pham,A Sutono,J Laskar,V Krishnamurthy,H S Cole,T Sitnik-Nieters.Development of Millimeter Wave Multi-layer Organic Based MCM Technology [M].IEEE MTT-S D igest,1998.1103-1106. 被引量:1
  • 6[6]Hiroshi Uchimura,Takeshi Takenoshita,Mikio Fujii.Development of a laminated wave guide [J].IEEE Transactions on Microwave Theory and Techniques,1998,46(12):243 8-2443. 被引量:1
  • 7严伟,洪伟,薛羽.低温共烧陶瓷微波多芯片组件[J].电子学报,2002,30(5):711-714. 被引量:23

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