摘要
光互联技术相对于传统的电互联技术具有高速、高带宽、低功耗、低损耗和抗电磁干扰等优势,在高性能计算机、高速交换系统及波分复用(WDM)终端等方向都具有巨大的应用前景。板级电路在电子系统中占据主导地位,就国内外板级波导光互联技术研究现状进行了阐述与分析,并对光电印制电路板(EOPCB)国内外发展水平进行了对比,为我国在该技术领域未来的主要研究方向及重点提供参考。最后对板级光电互联技术的发展趋势进行了展望。
Compared to the conventional electrical interconnects, the optical interconnects has the advantages of higher speed, higher bandwidth, lower power, lower propagation loss and anti-electromagnetic interference. This make the optical interconnects have the potential application prospects in many fields, such as high performance computer, high speed switching system, wavelength division multiplex （WDM） terminal and so on. The board-level circuits play a leading role in the electronic systems. Hence, the state of the art of waveguide-based board-level optical interconnects is introduced and analyzed. Moreover, through comparing the development status of the optical-electrical printed circuit board （EOPCB） in domestic and abroad, a reference of the main research direction and focus is provided for our country. Finally, the future development of the board-level optical interconnect technology is prospected.
出处
《激光与光电子学进展》
CSCD
北大核心
2016年第6期43-55,共13页
Laser & Optoelectronics Progress
关键词
光计算
光互联
光波导
光电印制电路板
optics in computing
optical interconnects
optical waveguide
optical-electrical printed circuit board
