期刊文献+

数字化红外焦平面技术 被引量:15

Digital IRFPA Technology
下载PDF
导出
摘要 数字化红外焦平面技术是从探测器起所有信号处理都在数字域完成的红外热成像技术,是目前国际上最先进的新一代红外焦平面技术。通过将模拟-数字转换器(ADC)集成到读出电路中实现数字读出,配合数字传输和数字图像处理形成数字化红外焦平面技术。通过中波640×512数字化红外焦平面探测器读出电路、成像组件以及数字化红外焦平面热像仪的设计和测试,表明数字化红外焦平面技术具有接口简单、高抗干扰、高通道隔离度、低读出噪声、高传输带宽、高线性度、高稳定性等特点,是红外热成像系统的技术发展趋势。 Digital IRFPA technology is a thermal IR imaging technology which signal from detector is processed in digital domain, and it is the most advanced IRFPA technology. It integrates analog-to-digital converter (ADC) on readout integrated circuit (ROIC) to realize digital signal read out, while the digital signal transmission and digital image processing are also utilized to form the Digital IRFPA technology. The digital IRFPA ROIC, digital imaging module and digital IRFPA thermal imager of MWIR 640 ~ 512 are designed and tested, and the measurement results indicate the Digital IRFPA technology has some positive features, such as simple interface, good resistance to interference, high channel isolation, low readout noise, wide transmission bandwidth, high linearity, high stability and so on. The Digital IRFPA technology is the developing trend of thermal IR imaging system.
机构地区 昆明物理研究所
出处 《红外技术》 CSCD 北大核心 2016年第5期357-366,共10页 Infrared Technology
关键词 数字化读出电路 数字化焦平面 探测器组件 数字成像组件 digital ROIC, digital IRFPA, detector module, digital imaging system
  • 相关文献

参考文献16

  • 1刘传明,姚立斌.红外焦平面探测器数字读出电路研究[J].红外技术,2012,34(3):125-133. 被引量:17
  • 2PAIN B,FOSSUM E.Approaches and analysis for on-focal-plane analog-to-digital conversion[C]//Proc.of SPIE,1994,2226:doi:10.1117/12.178483. 被引量:1
  • 3NESHER Ofer,ELKIND Shimon,ADIN Amnon,et al.Digital cooled In Sb detector for IR detection[C]//Proc.of SPIE,2003,5074:doi:10.1117/12.498154. 被引量:1
  • 4OIKNINE Schlesinger J,CALAHORRA Z,URI E,et al.Pelican-SCD's 640×512,15?m pitch InS b detector[C]//Proc.of SPIE,2007,6542:654231. 被引量:1
  • 5NESHER O,PIVNIK I;ILAN E,et al.High resolution 1280×1024,15?m pitch compact In Sb IR detector with on-chip ADC[C]//Proc.of SPIE,2009,7298:72983K. 被引量:1
  • 6ILAN Elad,SHILOAH Niv,DLKIND Shimon,et al.A 3 Mpixel ROIC with 10?m pixel pitch and 120 Hz frame rate[C]//Proc.of SPIE,2013,8659:86590A. 被引量:1
  • 7KRASHEFSKI B,ELLIOTT J,HAHN L,et al.A versatile,producible,digital,FPA architecture[C]//Proc.of SPIE,2006,6206:62062W. 被引量:1
  • 8REIBEL Y,PERE-LAPERNE N,AUGEY T,et al.Getting small,new10?m pixel pitch cooled infrared products[C]//Proc.of SPIE,2014,9070:907034. 被引量:1
  • 9白丕绩,姚立斌.第三代红外焦平面探测器读出电路[J].红外技术,2015,37(2):89-96. 被引量:24
  • 10陈楠,姚立斌.阵列型图像传感器模数转换技术[J].红外技术,2014,36(10):769-776. 被引量:8

二级参考文献77

  • 1Hsieh C C,Wu C Y,Jih F W,et al.Focal-plane arrays and CMOS readouttechniques of infrared imaging systems[C]//IEEE Trans.on Circuits andSystems for Video Tech.,1997,7:594-605. 被引量:1
  • 2Rosbeck J P,Starr R E,Price S L,et al.Background and temperaturedependent current-voltage characteractics of HgCdTe photodiodes[J].Appl.Phys.,1982,53:6430-6440. 被引量:1
  • 3Pelgrom M J,Duinmaijer A C J,Welbers A P.Matching properties ofMOS transistors[J].IEEE Solid-State Circuits,1989,24:1433-1440. 被引量:1
  • 4Yoon N,Kim B,Lee H C,et al.High injection efficiency readout circuitfor low resistance infra-red detector[J].IEE Electronics Letters,1999,35(18):1507-1508. 被引量:1
  • 5Bluzer N,Stehlik R.Buffered direct injection of photocurrents into chargecoupled devices[J].IEEE Trans.Electron Devices,1978,25(2):160–166. 被引量:1
  • 6Fowler A M,Probst R G,Britt J P et al.Evaluation of an indiumantimonide hybrid focal plane array for ground-based infraredastronomy[J].Opt.Eng.,1987,26:232–240,. 被引量:1
  • 7Kozlowski L,Cabelli S,Kezer R,et al.10×132 CMOS/CCD readout with25 m pitch and on-chip signal processing including CDS and TDI[C]//Proc.SPIE in Infrared Readout Electronics,1992,1684:222–230. 被引量:1
  • 8Hsieh C-C,Wu C Y,Sun T P,et al.High-performance CMOS bufferedgate modulation input(BGMI)readout circuits for IR FPA[J].IEEESolid-State Circuits,1998,33:1188-1198. 被引量:1
  • 9Kulah H.,Akin T.A current mirroring integration based readout circuitfor high performance infrared FPA applications[J].IEEE Trans.Circuits Syst.II,2003,50(4):181-186. 被引量:1
  • 10Kang S G,Woo D H,Lee H C.Multiple integration method for a highsignal-to-noise ratio readout integrated circuit.[J].IEEE Trans.CircuitsSyst.II,2005,52(9):299-302. 被引量:1

共引文献44

同被引文献62

引证文献15

二级引证文献51

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部