摘要
以甲基乙烯基硅橡胶(MVQ)为基体,偶联剂改性后的六方片状氮化硼(h-BN)为填料,使用密炼机密炼,双辊开炼机辊压混合,模压成型制备了导热绝缘复合材料。运用橡胶加工分析仪、扫描电子显微镜、导热分析仪及阻抗分析仪研究了h-BN用量对MVQ的动态模量、硫化特性、断面微观形貌、导热性能、电绝缘性能的影响。实验结果表明,随着h-BN用量的增加,MVQ的焦烧时间及正硫化时间缩短,理论硫化时间延长,热导率与介电常数上升,当h-BN填充量为50 phr时,h-BN/MVQ复合材料的热导率达到1.13 W/(m·K),介电常数为3.87。
The hexagonal boron nitride（ h-BN） modified with the coupling agent then was filled in methyl vinyl silicone rubber（ MVQ） by melt blending using a internal mixer and a two roll mixing mill,and then samples were prepared by compression molding. Elastic modulus,cure characteristic,morphology,thermally conductive property and dielectric constant were characterized by rubber process analyzer（ RPA）,scanning electron microscopy（ SEM）,thermal conductivity analysis instrument and impedance analyzer. The results show that Payne effect appears at the amount of 20 phr hBN. The elastic modulus,vulcanization time,thermal conductivity and the dielectric constant increase with increasing h-BN amount; but with the increasing h-BN amount,the scorch time and curing time is shortened. When the h-BN amount is 50 phr,the thermal conductivity and dielectric constant of h-BN / MVQ composites are 1. 13 W /（ m·K） and3. 87 respectively,the comprehensive performance is better.
出处
《高分子材料科学与工程》
EI
CAS
CSCD
北大核心
2016年第2期65-70,共6页
Polymer Materials Science & Engineering
基金
国家自然科学基金委员会-中国工程物理研究院联合基金资助项目(11176025)
四川省教育厅重大培育项目(14CZ0011)
四川省非金属复合与功能材料省部共建国家重点实验室培育基地开放基金项目(11zxfk01
12zxfk05)
关键词
甲基乙烯基硅橡胶
硫化特性
导热性能
介电常数
methyl vinyl silicone rubber
curing characteristics
thermal conduction
dielectric constant
