摘要
产品质量控制的整个过程中,试验设计(DOE)扮演了非常重要的角色,是产品质量提高、工艺流程改善的重要保证。本文通过对产品质量,工艺参数的量化分析,成功地应用SPC的工具,解决了锡浆厚度波动的问题,使得前线缺陷水平(DPU)明显减少,工序质量得到了明显提高。
During the whole process of product quality control,DOE plays a very importent role,It is a guarantee of product quality improvement and process improvement.The paper introduces how to application tool Successfully by quantitative analysis of process parameters.The problem of the thickness fluctuation of solder paste is solved,DPU ware Significantly reduced, Process quality has been significantly improved.
出处
《变频器世界》
2015年第12期66-70,共5页
The World of Inverters
关键词
锡浆
DOE
SPC
分析
工序能力
优化
Solder paste
DOE
SPCanalysis
Process capability
Optimize
