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基于光电检测的IC绑定压头系统设计 被引量:1

Design of IC Bonding Head System Based on Photoelectric Detection
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摘要 TFT-LCD制造技术,涉及半导体加工,集成电路整合等多种技术。TFT-LCD制造设备的稳定性对提高产品品质、降低成本及提高生产率有较大影响。根据现有IC绑定压头调整平坦度方案,提出了改进方案,设计了压头的实时检测系统,对设计的压头系统进行了原理分析和实验标定方案设计。实验结果表明,自动调整平坦度压头系统能够满足应用要求。 TFT-LCD manufacturing technology involves semiconductor processing, integrated circuit and other technology. The stability of manufacturing equipment has great influence on improving product quality and production efficiency and lowering the cost. According to the existing adjusting flatness method of IC bonding head, this paper puts forward the improvement scheme, designs a real-time detection system, analyzes the principle of the head system and sets up an experimental calibration scheme. The experimental results show that the automatic adjusting flatness head system can meet the application requirement.
出处 《机械制造与自动化》 2015年第6期141-144,共4页 Machine Building & Automation
关键词 光电检测 IC绑定压头 平坦度检测 压头结构设计 photoelectric detection IC bonding head flatness measurement head structure design
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