摘要
以端乙烯基硅油、含氢硅油、乙烯基MQ树脂为原料,气相法白炭黑为补强剂,氧化铝为导热填料,氧化铈为耐热填料,铂(0)-1,3-二乙烯基-1,1,3,3-四甲基二硅氧烷配合物为催化剂,2-乙烯基异戊醇为抑制剂,制备了电子封装用低黏、导热、耐热单组分加成型硅橡胶,并采用均匀设计试验进行了配方优化。较佳配方为:端乙烯基硅油100.00 g、乙烯基MQ树脂9.52 g、含氢硅油7.68 g、白炭黑4.51 g、氧化铝130.80 g、氧化铈2.31 g、铂催化剂1.20 g、2-乙烯基异戊醇0.20 g;所得封装胶硫化后的热导率为0.76 W/m·K,耐270℃×30 min热稳定性明显提高;所得封装胶应用于大功率整流二极管Cell粒子的封装,合格率高于市售国外某品牌产品。
Low viscosity,thermally conductive and heat resistant addition- type silicone rubber for electronic packaging was prepared by vinyl end silicone oil,hydrogen- containing silicone oil,vinyl MQ resin as the raw materials,fumed silica as the reinforcing agent,alumina as the conductive filler,cerium oxide as the resistant filler,platinum（ 0）- 1,3- divinyl- 1,1,3,3- tetramethyldisiloxane complex as the catalyst,and 2- vinyl iso- amyl alcohol as the inhibitor. The optimization of the formulation was carried out by uniform design experiments. Results showed that the proper formulation as followed： 100. 00 g of vinyl end silicone oil,9. 52 g of vinyl MQ resin,7. 68 g of hydrogen- containing silicone oil,4. 51 g of fumed silica,130. 80 g of alumina,2. 31 g of cerium oxide,1. 20 g of platinum catalyst,and 0. 20 g of 2- vinyl isoamyl alcohol. The thermal conductivity of the vulcanized silicone rubber was 0. 76 W / m·K,whose thermal stability（ 270℃ ×30 min） was obviously improved. The qualification rate of the large power diode cell particle encapsulated the electronic packaging was higher than that of foreign products.
出处
《有机硅材料》
CAS
2015年第6期437-443,共7页
Silicone Material
基金
上海张江国家自主创新示范区专项发展资金2015年度第一批重点项目(201501-PT-C104-013)
关键词
硅橡胶
导热
耐热
加成型
电子封装
silicone rubber
thermally conductive
heat resistant
addition-type
electronic packaging
