摘要
频段在3Ghz-20Ghz或者其它更高频段的高频印刷电路板使用板材相比普通FR-4板材而言，高频材料介层树脂辅助填料多，其介层树脂物理特性比较硬，对钻孔生产钻咀磨耗大，孔壁粗糙度大及钻咀磨擦高温凝胶过多，易造成钻孔后孔壁异常及除胶不净导致ICD不良产生，对产品将造成巨大的信赖度品质隐患，高频印刷电路板ICD问题成为一直以来是困扰业界的一个难题。文章主要从钻孔，除胶，等工序分析ICD产生的原因及针对高频材料印刷电路板钻孔，除胶参数DOE试验验证寻找改善方案。
Spectrum at 3-20 GHZ or other higher frequency of high frequency printed circuit boards use plate than normal FR4 board. The auxiliary packing has higher frequency dielectric layer resin. Its dielectric layer physical properties of resin is hard, drill tip abrasion on drilling production is big, big hole wall roughness and friction drilling tsui HTG is overmuch, easy to cause abnormal after drilling the hole wall and lead to adverse produce ICD. In addition to the glue, it is not clear with the quality of the trust products, which will cause great hidden dangers. And high frequency printed circuit board ICD problem has been a difficult problem in the industry. This article, mainly from ~e process such as hole and the glue, analyzes the causes of ICD for the material of high frequency printed circuit board in drilling and glue DOE test to find parameters to improve the solution.
出处
《印制电路信息》
2015年第A01期407-416,共10页
Printed Circuit Information
