摘要
随着高频RF(射频)和PA(功放)等大功率电子元件对PCB散热能力的要求越来越高,业界开始引入了在PCB印制板内部嵌埋铜块的制造工艺,称之为嵌埋铜板,同时为节约高频材料的用料成本,只在射频线路部分设计为高频材料局部混压,目前大部分产品为两种工艺同时结合。将完成单面线路制作后的高频材料和散热铜块是在压合前叠层之后埋入,同时散热铜块还要进行机械加工出相应的功放元件放置槽,文章将详细阐述高频材料局部混压嵌埋铜块的制造流程设计和工艺控制方法,以供业界同行参考。
With the higher frequency RF or higher PA electronic component put more and more request to the PCB radiating heat capacity, the industry developed fabrication process of buried copper coin in PCBs, called embedded copper coin board. To save cost of materials with the high speed low loss laminate, so the companies design partial lamination in FR4 only on the RF part, and most products were combined two kinds of technologies. Put the ifnished single side circuit of the high speed material board and copper coin buried after stack before pressing, the copper coin shall be machine out component placing slots for power amplifier. This article will elaborate the fabrication process design, manufacturing control for high-frequency material partial hybrid lamination with buried copper coin in PCB, for community fellow reference.
出处
《印制电路信息》
2013年第S1期419-424,共6页
Printed Circuit Information
关键词
散热
局部混压
埋铜
除胶
Radiating Heat
Partial Hybrid Laminate
Embedded Copper Coin
Removal Smear
