摘要
针对陶瓷基微热板MEMS器件难以微加工,器件表面加热Pt膜使用普通正性光刻胶难以实现光刻剥离的工艺难点问题,提出了激光微加工和柔性机械剥离相结合的微加工方法。以Al N陶瓷为衬底基片,采用激光微加工技术实现热隔离刻蚀体加工,刻蚀梁宽可达0.2 mm。采用柔性机械剥离工艺制备方法解决普通正性光刻胶形成倒梯形凹槽Pt膜难实现图形化问题,可在复杂表面特性的陶瓷基衬底上实现Pt膜剥离线宽10μm。同时利用有限元法进行传感器阵列设计和热结构仿真,验证设计工艺的可行性。
In order to solve the problems of difficult machining of ceramic-based micro-hotplate MEMS devices and failure lithography stripping of Pt film using conventional positive photoresist,AlN ceramic is as a substrate for the micro-hotplate sensor array and the laser micromachining technology is employed to realize the thermal isolation etching,the etched beam width in the thermal isolation structure is about 0. 2 mm. In addition,a flexible mechanical lift-off method is also proposed to solve the difficult lithography stripping of Pt film with an inverse-echelon indentation using conventional positive photoresist. This method can realize a 10 μm line width of lithography stripping of Pt film on ceramic-based substrate. Moreover,ANSYS software is explored to design the senor array and simulate its thermal structure.
出处
《传感器与微系统》
CSCD
2015年第8期87-90,共4页
Transducer and Microsystem Technologies
基金
黑龙江省自然科学基金重点资助项目(ZD201217)
黑龙江省自然科学青年基金资助项目(QC2013C059)
黑龙江省教育厅科技计划资助项目(12541141)
关键词
微机电系统
陶瓷微热板
传感器阵列
光刻剥离
MEMS
ceramics micro-hotplate
sensor arrays
photolithography lift-off
