摘要
以镀速、镀层中磷的质量分数及稳定常数为评价指标,考察了硫脲、硫代硫酸钠和DL-半胱氨酸分别作为稳定剂时的效果.结果表明：硫脲的质量浓度在0.5～3.0 mg/L之间,硫代硫酸钠的质量浓度在3～7 mg/L之间,DL-半胱氨酸的质量浓度在1～5 mg/L之间时,DL-半胱氨酸为最佳稳定剂.此时,镀速为10.67 μm/h,镀层中磷的质量分数为10.00％,稳定常数为95.51％.
The effects of three types of sulfur-containing stabilizer, that is, thiourea, sodium thiosulfate and DL-cysteine, on the plating rate and phosphorus mass fraction in coating were investigated when they were used independently. Results showed that DL-cysteine was the optimal stabilizer under the conditions of thiourea 0. 543.0 mg/L, sodium thiosulfate 3～7 mg/L and DL-eysteine 1～5 mg/L. And furthermore, the plating rate was 10.67μm/h, the phosphorus mass friction in coating was 10.00%, and the stability constant was 95.51%.
出处
《电镀与环保》
CAS
CSCD
北大核心
2015年第3期32-35,共4页
Electroplating & Pollution Control
基金
铝合金化学镀镍关键技术开发(黔科合GY字[2013]3035)
关键词
化学镀镍
稳定剂
镀速
磷的质量分数
稳定常数
electroless nickel plating
stabilizer
plating rate
phosphorus mass fraction
stability constant
