摘要
考察了电流密度、镀液温度、镀液pH值和搅拌速率对镀镍层表面粗糙度的影响,并对氨基磺酸盐镀镍工艺进行优化。最优工艺条件为:电流密度8A/dm2,镀液温度45℃,镀液pH值5.0,搅拌速率0.5m/s。在该条件下施镀,获得的镀镍层平整、光亮,表面粗糙度约为0.63μm,并且微观组织致密。
Influences of current density, bath temperature, bath pH value and agitation velocity on the surface roughness of nickel coating were investigated, and the process conditions for sulfamate nickel electroplating were optimized. Results showed that the optimum conditions were determined as follows： current density 8 A/dm^2 , bath temperature 45℃, bath pH value 5.0 and agitation velocity 0.5 m/s. And furthermore, a nickel coating with smooth surface and compact structure was obtained, its surface roughness was about 0.63μm.
出处
《电镀与环保》
CAS
CSCD
北大核心
2015年第3期9-11,共3页
Electroplating & Pollution Control
关键词
工艺条件
镀镍层
表面粗糙度
微观组织
process condition
nickel coating
surface roughness
microstructure
