摘要
采用磁控溅射技术在钼圆片基体表面制备了镍薄膜,并用扫描电镜、平整度仪和X射线衍射分析仪对其进行了表征。研究了不同负偏压对薄膜附着力、微观结构、平整性、晶粒取向以及大小的影响。结果表明,随负偏压增大,薄膜与基体结合力明显增强;适当的负偏压能改善薄膜表面致密性和平整性,在450 V时达到最优。但当负偏压进一步升高到600 V时,镍膜的表面起伏反而变大,平整性有所下降。负偏压对镍膜晶面生长的择优取向影响并不明显,而晶粒尺寸随负偏压增加呈增大的趋势。
Nickel films were formed on molybdenum discs by magnetron sputtering and characterized by scanning electron microscope, flatness tester, and X-ray diffractometer. The effect of negative bias voltage on adhesion strength, microstructure, smoothness, as well as crystal orientation and size of nickel film was discussed. The results showed that the adhesion of nickel film to substrate is increased observably with increasing negative bias voltage. An appropriate negative bias voltage can improve compactness and smoothness of nickel film. The optimal negative bias voltage is 450 V. However, when the negative bias voltage reaches 600 V, the surface fluctuation of nickel film is increased, while the film smoothness is declined. The effect of negative bias voltage on preferred orientation of nickel film is not obvious. The grain size of nickel film presents a trend of increase with increasing negative bias voltage.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2015年第8期437-440,479,共4页
Electroplating & Finishing
关键词
钼
镍
磁控溅射
负偏压
附着力
表面形貌
晶粒尺寸
molybdenum
nickel
magnetron sputtering
negative bias voltage
adhesion
surface morphology
grain size
