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添加微量TiC对钨的性能与显微组织的影响 被引量:6

Effect of microscale Ti C on performance and microstructure of tungsten
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摘要 为细化钨晶粒,采用粉末冶金方法通过添加加量Ti C于钨基体中制备W-Ti C合金,研究了微量Ti C的添加对钨性能与显微组织的影响。结果表明:当Ti C的添加量为1%(质量分数),烧结温度为1890℃时,W-Ti C合金具有最佳性能,其拉伸强度可达401 MPa,致密度为97.4%;添加的Ti C粉末以球状二次相粒子形式分布于晶界和晶内,与纯钨相比,Ti C的添加有效地抑制了晶粒长大,对钨基体起到细晶强化与弥散强化作用。 In order to refine the grain size of W, W-CTiC alloy was fabricated by powder metallurgy method through adding microscale TiC into W matrix. The effects of microscale TiC on performance and microstructure of W were investigated. The results show that W-1TiC (mass fraction, %) exhibits the best performance at the temperature of 1890℃, its relative density and tensile strength can reach to 97.4% and 401 MPa, respectively. The microscale TiC in the form of second phase particles disperses on the W transgranular and grain boundary uniformly. Comparing with pure W, the addition of microscale TiC can inhibit the grain growth, which plays the role of fine-grain strengthening and dispersed strengthening.
出处 《中国有色金属学报》 EI CAS CSCD 北大核心 2015年第1期80-85,共6页 The Chinese Journal of Nonferrous Metals
基金 国家科技部重大专项(2014GB115000) 教育部博士点基金资助项目(20130162130002)
关键词 W-TiC合金 二次相粒子 细晶强化 弥散强化 烧结行为 W-TiC alloy second phase particle fine-grain strengthening dispersed strengthening sintering behavior
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