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不同金属基体上W-C:H溅射薄膜的摩擦学性能 被引量:1

Tribological Properties of Sputtered W- C: H Films on Several Metallic Substrates
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摘要 采用非平衡磁控溅射技术在40Cr、9Cr18、GCr15、TC4及LY12等5种金属基体上沉积了钨掺杂含氢类金刚石(W-C:H)薄膜.采用Raman光谱仪、扫描电子显微镜、纳米硬度计及纳米划痕仪分别测试了薄膜的微结构、厚度、硬度及附着力,采用球-盘摩擦试验机及光学轮廓仪分别在干摩擦和PFPE脂润滑条件下评价了5种金属材料基体上薄膜的摩擦磨损性能.薄膜性能测试结果显示,该厚度为1μm的薄膜具有典型的类金刚石结构,硬度与弹性模量分别为11.56和128.34 GPa,附着力为645 mN;摩擦试验结果显示,在干摩擦条件下几种金属基体表面W-C:H薄膜的摩擦因数和磨损率差别比较显著,而在脂润滑条件下基体材料的影响较小;与干摩擦条件相比,脂润滑条件下薄膜的磨损可减少60% ~75%;在干摩擦与脂润滑条件下,9Cr18与40Cr基体上的W-C:H薄膜摩擦体系分别具有最小的磨损率1.71×10-7 mm3/(N·m)及4.55×10-8 mm3/(N·m). Tungsten doped hydrogenated diamond-like carbon films (W- C:H ) were deposited on 40Cr, 9Cr18, GCrl5, TC4 and LY12 substrates with the unbalanced magnetron sputtering method. The surface morphology, mierostructure, microhardness, adhesion, and tribological properties of the films were characterized by scanning elec- tron microscope (SEM), Raman spectroscope, nano-hardness/scratch tester, and ball-on-disk tribo-meter respective- ly. The effect of different substrate materials on tribological properties of the deposited films were studied under dry friction and PEPE grease lubrication conditions. Films quality testing results shows the films with 1 μm thickness have typical diamond-like structures and exhibit high hardness 11.56 GPa, elastic modulus 128.34 GPa, and good adhen- sion 645 mN. Tribological test results show that the friction coefficient and wear rate of the films deposited on several metal substrates are significant different in dry sliding, and the substrate effect is smaller under grease lubrication. Compared with the friction results in dry sliding, the wear under grease lubrication can reduce 60% to 75 %. The W- C : H films deposited on 9Cr18 and 40Cr substrates provide the minimum wear rate of 1.71×10-7 mm3/(N·m)and4.55×10-8 mm3/(N·m) in dry sliding and grease lubrication respectively.
出处 《宇航材料工艺》 CAS CSCD 北大核心 2015年第1期57-61,共5页 Aerospace Materials & Technology
关键词 W-C:H薄膜 摩擦学 PEPE润滑脂 力学性能 非平衡磁控溅射 W-C : H films, Tribology, PEPE lubricant, Mechanical properties, Ubalanced magnetron sputtering
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