摘要
研究了表面化学镀前处理工艺中活化条件（如活化时间、活化温度、活化pH值）对PS微球镀镍层的致密性、均匀性、导电性的影响,对活化后的PS微球进行了SEM和导电性测试。结果表明,在氯化钯用量为0.05g、活化时间为80-120min、活化温度为34℃、活化pH值为3-4的条件下,PS微球具有良好的镀层致密性及优良的导电性。
Effect of activation conditions such as activation time,activation temperature,and activation pH value in the process of PS microspheres surface electroless plating pretreatment on densification,uniformity and conductivity of PS microspheres plated nickel layer were studied.The activated PS microspheres were analyzed by SEM and conductivity test.Results showed that activated PS microspheres had good densification and conductivity under the optimal conditions as follows：dosage of palladium chloride was 0.05 g,activation time was80-120min,activation temperature was 34 ℃ and activation pH value was 3-4.
出处
《化学与生物工程》
CAS
2015年第2期67-70,共4页
Chemistry & Bioengineering
关键词
化学镀
活化
PS微球
致密性
electroless plating
activation
PS microspheres
densification
