摘要
探讨了泡沫基体上化学镀镍过程中,NiSO4、醋酸、次磷酸钠、加速剂(氨基酸类物质)的含量,温度及pH对镀层中磷含量的影响。得到了泡沫基体上化学镀镍最佳工艺条件:30g/LNiSO4·6H2O,110g/L醋酸,10g/L次磷酸钠,4g/L加速剂,pH10,温度45°C。该工艺可获得磷含量为3%的镀层,镀液稳定性良好。
In the process of electroless Ni plating on spongy, the effects of temperature, pH and the contents of NiSO4, acetic acid, sodium hypophosphite, accelerator （amino acid） on the phosphorous content in the electroless Ni plating deposit on spongy were discussed. The optimum process conditions were obtained as follows： 30 g/L of NiSO4·6H2O, 110 g/L of acetic acid, 10 g/L of sodium hypophosphite, 4 g/L of accelerator, pH 10, temperature of 45℃. A deposit with 3% of phosphorous can be obtained by the process, and the stability of the bath is good.
出处
《电镀与涂饰》
CAS
CSCD
2007年第2期22-24,共3页
Electroplating & Finishing
关键词
聚氯酯泡沫
化学镀镍工艺
低磷
加速剂
isocyanurate spongy
electroless nickel plating process
low phosphorous
accelerator
