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耐高温环氧有机硅灌封胶的研制 被引量:5

Study on preparing epoxy-silicon potting adhesive with high temperature resistant
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摘要 将带有活性基团的有机硅预聚体与环氧树脂(EP)在一定条件下反应4 h后,合成了环氧有机硅树脂;然后加入自制的活性硅微粉、适宜的固化剂和固化促进剂,制得环氧有机硅灌封胶。研究结果表明:采用单因素试验法优选出制备该灌封胶的最佳配方是w(改性复合酸酐)=75%、w(促进剂)=1%和w(自制活性硅微粉)=40%(均相对于环氧有机硅树脂质量而言),此时灌封胶的耐热性能和粘接性能俱佳,其起始固化温度由150℃左右降至120℃左右,常温剪切强度超过17 MPa,300℃剪切强度超过2 MPa。 An epoxy- silicon resin was synthesized when reaction between silicone prepolymer with activegroup and epoxy resin(EP)was realized for 4 h under a certain conditions. Then,an epoxy-silicon potting adhesivewas prepared by adding self-made activated silicon powder,suitable curing agent and curing catalyst. The researchresults showed that the optimal formula of preparing potting adhesive was preferred by single- factor experimentwhen mass fractions of modified composite anhydride,accelerant and self-made activated silicon powder were 75%,1% and 40% respectively in epoxy- silicon resin. Here,the potting adhesive had the good heat resistance andbonding properties because its initial curing temperature was decreased from about 150 ℃ to about 120 ℃,theshear strengths were above 17 MPa at normal temperature and above 2 MPa at 300 ℃.
出处 《中国胶粘剂》 CAS 北大核心 2014年第12期30-33,37,共5页 China Adhesives
关键词 环氧有机硅树脂 灌封胶 耐高温 粘接性能 epoxy-silicon resin potting adhesive high temperature resistant bonding property
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