摘要
当前航天电子材料的使用环境为-55～125℃，而火星的最低温度可达-120℃，月表最低温度可达-180℃。考虑到深空探测器的自带能源紧张的问题，研究在无主动热控措施条件下，探测器电缆、电子设备的可靠性具有重要的意义。综述了国内外在极低温大温变条件下钎料、焊点及各种焊接结构的可靠性研究进展。
The typical space material rating is-55 ℃to＋125℃, while the minimum temperature on moon surface is about-180 ℃, on Mars is-120 ℃. It is significant to study the reliability of detector cable, electronic equipment in the deep space environment with extreme temperature condition without the need for thermal control, considering the problem of energy shortage of detector in deep space. The progress of reliability study on solder, solder joints and various soldering structure in extreme low temperature and wide range temperature condition is reviewed.
出处
《电子工艺技术》
2014年第5期271-276,共6页
Electronics Process Technology
关键词
极低温环境
焊料脆性
可靠性
Extreme low temperature condition
Solder
Brittle
Reliability
