摘要
研究了无氰镀银工艺中镀液温度和电流密度对镀层微观形貌的影响。结果表明,低电流密度区置换对镀层起到决定作用,镀层结晶度高。推荐电流密度范围内结晶细腻,外观光亮。更高的电流密度导致结晶粗糙。不同温度对结晶的特点略有影响,但不显著。实验表明,镀层的形成包含了结晶成核和晶体生长两个步骤。每个步骤主要包括置换和电沉积两个驱动力。
Effects of temperature and current density on coating microscopic morphology in cyanide-free silver plating were studied. Results showed that：in low current density area, chemical replacement dominated the coating deposition and crystallinity was high;in recommended current density area, the crystallization was fine and smooth and the appearance was bright, beyond this area,higher current density would lead to rough crystallization. Different temperature would affect the crystallization characteristics slightly, but not significantly. Experimental results showed that the coating formation involved two-steps namely crystal nucleation and crystal growth and each step involved two driving forces namely chemical replacement and electro-deposition.
出处
《电镀与精饰》
CAS
北大核心
2014年第7期12-15,19,共5页
Plating & Finishing
关键词
无氰镀银
扫描电镜
微观结构
温度
电流密度
cyanide-free silver plating
scanning electron microscopy
microscopic structure
temperature
current density
