摘要
对ＵＬＳＩ中多层金属铜布线的ＣＭＰ（化学机械抛光）进行了理论分析，介绍了Ｃｕ－ＣＭＰ模型与机理及其动力学过程，抛光液的种类及其存在的问题，并对Ｃｕ－ＣＭＰ的研究作了进一步探讨．
The CMP of Copper interconnects in ULSI was analysised in thiery, with the detailed introduce of the model and mechamism of Cu-CMP, the processes of Kinetics, the types of slurry for Cu - CMP and the existed questions. At the same time, the investigate of Cu - CMP was discussed further.
出处
《河北工业大学学报》
CAS
2002年第1期33-37,共5页
Journal of Hebei University of Technology
基金
国家自然科学基金资助项目(60176033 )
河北省自然科学基金资助项目(013605911)
关键词
ULSI
铜
化学机械抛光
抛光液
ULSI
copper
chemical mechanical polishing
slurry
