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千兆校园网解决方案

Solution of Gigabit Campus Area Network
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摘要 随着多媒体技术的发展和视频点播、实时网络远程教学的要求 ,以太网技术会越来越受到限制 ,将ATM技术和以太网技术结合起来 。 With the development of multimedia technique and the demand of viedo-on-demand and real-time-network long-distance teaching, The technique of Ethernet is more and more limited. In the article,We'll combine the technique of ATM with the technique of Ethernet to introduce one kind of practical solution of Gigabit Campus Area Network.
作者 房华 张意军
出处 《信息技术》 2002年第4期36-37,共2页 Information Technology
关键词 宽带网 视频点播 千兆校园网 计算机网络 Gigabit Campus Area Network Main-network Broadband Network viedo-on-demand
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  • 1[8]Suganuma K, Murata T, Noguchi H, et al. Heat resistance of Sn-9Zn solder/Cu interface with or without coating[J]. J Mater Res, 2000, 15: 884-891. 被引量:1
  • 2[9]Suganuma K, Niihara K, Shoutaku T, et al. Wetting and interface microstructure between Sn-Zn binary alloys and Cu[J]. J Mater Res, 1998, 13: 2859-82865. 被引量:1
  • 3[10]Loomans M E, Vaynman S, Ghosh G, et al. Investigation of multi-component lead-free solders[J]. J Electon Mater, 1994, 23: 741-746. 被引量:1
  • 4[11]Nash P, Nash A. ASM Handbook, Alloy Phase Diagram Vol.13[M]. ASM International, Materials Park, OH, 1990. 132. 被引量:1
  • 5[12]Park J Y, Kang C S, Jung J P. The analysis of the withdraw force curve of the wetting cure using 63Sn-37Pb and 96.5Sn-3.5Ag eutectic solders[J]. J Electron Mater, 1999, 28: 1256-1262. 被引量:1
  • 6[1]Lee N C. Lead-free soldering-where the world is going[J]. Advancing Microelectronics, 1999, 26: 29-35. 被引量:1
  • 7[2]Lee N C. Getting ready for lead-free solders[J]. Soldering Surf Mount Technol, 1997, 28: 65-68. 被引量:1
  • 8[3]Glazer J. Metallurgy of low temperature Pb-free solders for electronic assembly[J]. Int Mater Rev, 1995, 40: 65-92. 被引量:1
  • 9[4]Abtew M, Selvaduray G. Lead-free solders in microelectronics[J]. Materials Scince and Engineering, 2000, 27: 95-141. 被引量:1
  • 10[5]Anderson I E, Foley J C, Cook B A, et al. Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability[J]. J Electon Mater, 2001, 30: 1050-1059. 被引量:1

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