摘要
本文通过观察聚晶金刚石 (PCD)磨削表面的微观形貌及背散射立体像 ,研究了PCD材料的磨削机理。结果表明 ,在磨削过程中 ,PCD材料会产生冲击脆性去除、沿晶疲劳脆性去除、疲劳点蚀脆性去除、热化学去除及机械热去除。其主次顺序取决于磨削工艺参数。因冲击脆性去除直接产生PCD刀具刃口锯齿缺陷 。
Through observing the microcosmic image and back-scattered three-dimensional picture of the ground surface of polycrystalline diamond (PCD),this paper studied the grinding mechanism of PCD material. The research results showed that the shock-brittle removal, fatigue-brittle removal along crystal boundary, fatigue-corrosive-brittle removal in dots, heat-chemical removal and machinery-heated removal would occur in the grinding process of PCD material. The primary and secondary sequence of these removal fashions depend on the grinding parameters. Because the sawtooth-style edge defects often appear in the fashion of shock-brittle removal, this removal fashion should be kept away from the grinding process of the PCD material.
出处
《金刚石与磨料磨具工程》
CAS
2002年第2期52-53,56,共3页
Diamond & Abrasives Engineering
