摘要
混合集成电路外壳镀镍按照 GJB548A要求 ,镀层要经受 2 4 h以上盐雾试验 ,引线要通过抗疲劳强度试验。直流镀镍层的引线随厚度的增加 ,抗疲劳强度呈直线下降。多波形电流镀镍层的引线抗疲劳强度所允许的镀层厚度比直流镀层成倍增加 ,从而提高了外壳的抗腐蚀性能。
Nickel coating on hybrid integrated circuit packages, according to the requirement specified in The Standards of Test Methods and Procedures for Microelectronics GJB548A, must with stand 24 h neutral salt spray test, and the nickel plated leads must pass through the fatigue strength test. The lead fatigue strength is decreased linearly with the increase in nickel coating thickness. For a given limited lead fatigue strength value, the permited thickness of nickel coating of multiwave current plating is about one time larger than that of direct current plating, and the corrosion resistence is greatly improved. Detailed experimental results are given in this paper.
出处
《电镀与精饰》
CAS
2001年第4期5-8,共4页
Plating & Finishing
关键词
集成电路外壳
多波形电流电镀
镀镍
引线
疲劳强度
镀层厚度
hybrid integrated circuit package
multiwave current plating
plating nickel
lead fatigue strength
