摘要
用电化学方法和扫描电子显微镜研究了钢铁置换镀铜反应及镀层形貌 ,结果表明 :钢铁表面的置换铜镀层总是多孔的。加入增大铜、铁阴阳极极化的有机添加剂可以使镀层致密 ,减少孔隙总面积 ,有利于提高铜镀层与基体的结合强度。
The reaction of chemical replacement copper plating on iron surface and profile of the coating have been investigated by electrochemical methods and scan electron microscopy. The results show that the copper chemical replacement coatings are always porous. Addition of organic additives inhibiting copper cathodic reaction and iron anodic reaction can improve the quality of replacement coating.
出处
《电镀与精饰》
CAS
2001年第4期1-4,共4页
Plating & Finishing
