摘要
指出了普通镀铜工艺的缺点。通过对铜原子结构的分析,提出了得到良好结合力的化学镀铜层的可能性,进而给出了使用"考本"液在钢铁上直接化学镀铜的工艺。该工艺操作简单、安全性好、成本低,得到的镀层与钢铁基体结合力好,表面可以达到镜面光泽。
The disadvantages of common electroless copper plating process were pointed out. By analysing the structure of copper atom, the possibility of obtaining one electroless copper plating deposit with good adhension was presented, and thereby a direct electroless copper plating process on steel with Compen solution was given. The process has advantages of easy operation, high security and low cost. The desposits obtained by it have good adhesion to steel substrates and mirror luster appearance.
出处
《电镀与涂饰》
CAS
CSCD
2005年第4期44-45,共2页
Electroplating & Finishing
