摘要
提出了新抛光硅片镜面吸附动力学过程；深入研究表面活性剂的性质和作用；利用表面活性剂特性，有效地控制硅片表面颗粒处于易清洗的物理吸附状态。
An adsorption kinetics model for adsorbate on the spectrally polished silicon wafer was suggested. Researching quality and effect of surfactants deeply. By the utility of surfactants, the adsorption of particles on the Si wafer surface can be controlled to keep in physical adsorption station which is easy to clean.
出处
《半导体技术》
CAS
CSCD
北大核心
2001年第7期59-61,共3页
Semiconductor Technology
