摘要
通过正交试验得到了化学镀铜速率适中而稳定性极高的化学镀铜工艺 ;采用PdCl2 加速分解实验研究了多元络合剂化学镀铜液的稳定性。结果表明 :使用多元络合剂时存在交互作用可大大延长镀液的分解时间 ,同时使镀液的全面分解转变为少量颗粒上的缓慢分解。稳定剂的加入主要是抑制Cu+的生长 。
The technique of electroless copper deposition on printed circuit boards (PCB)with high stability and moderate rate is obtained by orthogonal experimenting and stability of multicomplexing electroless copper deposition is studied by adding PdCl 2 in solution.The results show that decomposing time of solution can be much prolonged and the overall decomposing of solution is transformed into slow and partial decomposing on few grains when using multicomplexing.Stabilizer plays a role in restraining Cu + and Cu 0 from producing.
出处
《南昌航空工业学院学报》
CAS
2001年第1期46-48,共3页
Journal of Nanchang Institute of Aeronautical Technology（Natural Science Edition）
关键词
印制版
化学镀铜
稳定性
正交试验
PCB
电镀
工艺
Printed circuit boards
Electroess copper deposition
Multicomplexing agent
Stability.
