摘要
采用有机镍的醇溶液对SiC粉体进行活化，以实现SiC粉体化学镀镍前的无钯活化。通过单因素试验研究了活化液中乙酸镍含量、硼氢化钠含量、活化温度、时间等参数对SiC粉体表面镍包覆率的影响，得到适宜的活化工艺条件为：乙酸镍0．6～30．0 g/L，硼氢化钠0．4～4．0 g/L，温度10～30℃，时间1～40 min。采用该工艺对SiC粉体活化后，其镍包覆率达100％，后续化学镀镍磺合金层均匀，为非晶态。
An alcohol solution of organic nickel was usedto activate SiC powder to realize palladium-free activationprior to electroless nickel plating. The effects of nickelacetate content and sodium borohydride content in activationsolution, as well as activation temperature and time on thenickel cladding ratio of SiC were studied by single factorexperiment. The suitable activation process conditions wereobtained as follows： nickel acetate 0.6-30.0 g/L, sodiumborohydride 0.4-4.0 g/L, temperature 10-30℃, and time1-40 min. The nickel cladding ratio of SiC reaches 100%after activating under the given process conditions. Theelectrolessly plated nickel-phosphorous alloy coating on thenickel-clad SiC is uniform and amorphous.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2014年第11期478-481,共4页
Electroplating & Finishing
基金
国家民委粉体材料与特种陶瓷重点开放实验室基金资助项目(2011SY04)
北方民族大学科研项目(2012Y048)
关键词
碳化硅粉体
化学镀镍
无钯活化
乙酸镍
silicon carbide powder
electroless nickelplating
palladium-free activation
nickel acetate
