摘要
研究了微量元素Mn和Zn对低银Sn-Ag-Cu无铅钎料钎焊接头组织和性能的影响。结果表明,Mn和Zn可使钎焊界面金属间化合物层(Cu3Sn和Cu6Sn5)变得薄而均匀;其可以增加低银钎料的钎焊接头的拉伸强度和剪切强度,最佳元素添加量为0.2%Zn和0.05%Mn(质量分数);断口形貌显示其接头为塑性断裂破坏。Mn、Zn的添加,使得钎料组织的方向性生长状态弱化,同时,可以抑制Cu6Sn5和Cu3Sn金属间化合物层在高温环境下的时效长大或粗化,表明其对接头的稳定可靠性也具有改善作用。
The effects of Mn, Zn elements on the low-silver Sn-Ag-Cu lead-free solder joint interface microstructure and its mechanical properties were studied. The results show that Mn, Zn can inhibit the growth of intermetallic compound （IMC） layer of the as-soldered joints, such as Cu6Sn5 and Cu3Sn. With adding Zn, Mn to the solder, the directional growth of the solder matrix in the solder joint is changed. By comparing the aged solder joint, it is found that Mn, Zn lic layer during the aging process. This is the reason why adding Mn, property tests show that Mn, Zn can increase the tensile strength and addition can restrain the coarsening of Cu6Sn5 and Cu3Sn intermetal- Zn can increase the solder joint＇s stability and reliability. Mechanical shear strength of the solder joint. However, adding Mn, Zn too much will worsen the mechanical property because of the wettability problem. When about 0.2wt%Zn and 0.05wt%Mn was added, both the ten- sile and shear strength came to the best value generally at the same time. The morphology of solder joint fracture shows that it is ductile fracture under the tensile and shear loads, and that is why the Mn, Zn IMC dispersed phase can improve the mechanical properties of the joint.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2014年第3期655-659,共5页
Rare Metal Materials and Engineering
基金
国家创新团队"863"课题(2009AA033901)
