摘要
通过试制样品的有功率性能测试和无功率性能测试的冲击实验,分析了超小型泵浦激光器反馈片紫外胶连接抗冲击性能影响因素,结果表明,样品外壳冲击变形的局部应力导致反馈片胶连接产生冲击裂纹损伤;样品冲击后的功率-电流-温度(P-I-T)性能测试的热胀冷缩产生热应力,促进了胶连接内亚裂纹扩展并形成了絮状纹,且促进反馈片胶连接冲击裂纹扩展并成为新的裂纹生长的潜在因素,劣化了胶连接性能.
The effect of the microminiature diode pump solid state laser （MDPSSL） samples＇ feed- back wafer ultraviolet curing adhesive bonding was researched via the impacting experiments with P-I- T performance test and without P-I-T performance test. The local stress of shell impacting deformation would lead to the impacting crack of the feed-back wafer adhesive bonding. Thermal stress of the sam- ple was produced due to thermal expansion and contraction, undergoing the P-I-T performance test af- ter the sample was impacted , which promoted the submicroscopic cracking of the feed-back wafer adhe- sive bonding and formed the floccule veins, and promoted the impacting cracks of the feed-back wafer adhesive bonding , became the potential factor of the forming of the new cracks and degraded the adhe- sive connectivity.
出处
《闽江学院学报》
2014年第2期45-51,127,共8页
Journal of Minjiang University
关键词
泵浦激光器
反馈片
紫外胶固化连接
抗冲击性能
diode pump solid state laser
feed-back wafer
ultraviolet curing bonding
impact resis- tence
