摘要
在铜基体上沉积Cu(Cr)-diamond复合过渡层,用热丝CVD法在复合过渡层上沉积出金刚石膜。用压痕法对沉积的金刚石膜/基结合性能进行了研究。结果表明,在Cu-diamond上沉积的金刚石膜,用147 N压痕时压痕边缘出现大面积崩落,并在基体表面留下被拔出的金刚石凹坑;在Cu-diamond中掺入微量Cr,压痕边缘只形成环形裂纹,增大压痕载荷至441 N,环形裂纹区域增大,并出现部分崩落,崩落区域有被切断的金刚石残留。在Cu-diamond复合层中掺入微量Cr能显著提高金刚石膜/基结合力。
The continuous diamond films were fabricated on Cu（Cr）-diamond composite layer coated on copper substrates by hot-filament chemical vapor deposition （CVD） method. The adhesive characteristics between diamond coating and substrate were investigated by indentation test. The results show that diamond film coated on Cu-diamond composite interlayer is delaminated severely and pulling out craters are left on the delamination area are left on the periphery of imprint at 147N load indentation test. Doping a tiny amount of Cr into Cu-diamond layer can only detect concentric cracks on the periphery of imprint. Increasing indentation load to 441N results in the increase of the area of concentric cracks, and a small area of delamination containing a part of broken diamond particles is formed. The interracial adhesion between diamond film and copper substrate can be increased considerably by doping a tiny amount of chromium into Cu-diamond composite interlayer
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2014年第2期381-385,共5页
Rare Metal Materials and Engineering
基金
国家自然科学基金(51071070
51271079
50971062)
关键词
金刚石膜
镶嵌
复合镀
压痕
结合力
diamond films
inlay structure
composite plating
indentation
adhesive strength
