摘要
在含有氯化铜的氯化1-丁基-3-甲基咪唑(BMIC)和乙二醇(EG)体系中研究金属铜的电沉积。在BMIC中加入EG,分别研究了EG对离子液体BMIC的粘度和电导率的影响,并通过循环伏安法研究了BMICCuCl2-EG溶液中Cu(Ⅱ)的电化学行为,考察了乙二醇浓度、温度和扫描速度对Cu(Ⅱ)电化学行为的影响。结果表明,Cu(Ⅱ)的电还原过程分为两个过程,其中Cu(Ⅱ)/Cu(Ⅰ)是扩散控制下的不可逆过程,Cu(Ⅰ)/Cu是不可逆过程。计算得出,在343 K时,Cu(Ⅱ)/Cu(Ⅰ)还原过程中的扩散系数D为7.0×10-7cm2/s,传递系数为0.24。在Cu膜表面进行了电沉积,获得金属铜颗粒,经扫描电子显微镜观察Cu的电沉积层的形貌发现,在343 K时沉积30 min后,金属铜晶粒致密,将沉积时间延长至2 h后,晶粒呈球状。
The electrodeposition of metallic copper in the solution of ethylene glycol（EG） and 1-butyl-3-methylimidazolium chloride（BMIC） containing CuCl2 was studied. The effect of EG on the viscosity and the effect of BMIC on the conductivity were investigated. Cyclic voltammetry was performed to study the electrodeposition of Cu（Ⅱ） in BMIC-CuCl2-EG. The electrodeposition of Cu（Ⅱ） was affected by the scanning rate, temperature and the content of EG. The reduction of Cu（Ⅱ） consistes of two processes. Both the redox processes of Cu（Ⅱ）/Cu（Ⅰ） and Cu（Ⅰ）/Cu are irreversible, in which Cu（Ⅱ）/Cu（Ⅰ） is under the control of diffusion. The diffusion coefficient of Cu（Ⅱ）/Cu（Ⅰ） is calculated to be 7.0×10^-7 cm^2/s and the transfer coefficient to be 0.24 at the temperature of 343 K. The metallic copper grains were electrodeposited on the copper film. Based on the scanning electron microscope micrographs, these grains demonstrate the dense location after the electrodeposition for 30 minutes at 343 K. These grains turn into globular morphology after the electrodeposition for 2 h.
出处
《应用化学》
CAS
CSCD
北大核心
2014年第2期212-219,共8页
Chinese Journal of Applied Chemistry
基金
国家自然科学基金资助项目(21063013)
新疆维吾尔自治区高校科研计划项目(XJEDU2012I05)~~
关键词
循环伏安
氯化丁基甲基咪唑
铜
电沉积
乙二醇
cyclic voltammetry, butyl-methylimidazolium chloride, copper, electrodeposition, ethylene glycol
